MediaTek launched its Dimensity 9000 5G SoC on 16th December 2021. The Taiwanese semiconductor giant has announced device maker adoption and endorsement from major smartphone manufacturers like Honor, Oppo, Vivo, and Xiaomi.  

The MediaTek Dimensity 9000 SoC is built on TSMC's 4nm process and it integrates a 10-core Arm Mali-G710 GPU and has an octa-core architecture with Arm Cortex CPUs.

MediaTek mentioned in a press release that the first smartphones to be powered by the new MediaTek Dimensity 9000 5G SoC will begin releasing in the first quarter of 2021.

It is fabricated using TSMC's 4nm process and integrates a 10-core Arm Mali-G710 MC10 GPU and MediaTek APU 590.

It integrates Armv9 architecture with one Arm Cortex-X2 CPU clocking at up to 3.05GHz, three Arm Cortex-A710 CPUs with a maximum clocking speed of 2.85GHz, and four ARM Cortex-A510 CPUs.

It supports LPDDR5x RAM with up to 7,500Mbps speeds.

MediaTek Dimensity 9000 5G SoC integrates the firm's fifth-gen Application Processor Unit (APU 5.0) which is claimed to give 4x power efficiency gains compared to previous-gen APUs.

MediaTek's flagship SoC also has 18-bit HDR MediaTek Imagiq 790 ISP, 3GPP Release 16 5G modem, MediaTek MiraVision 790 that support 144Hz WQHD+ display or 180Hz Full-HD+ displays.

The Dimensity 9000 5G SoC is claimed to provide customization to smartphone manufacturers that can help them create 5G-enabled handsets that stand out.

Moreover, Dimensity 9000 packs the world’s first Arm Mali-G710 MC10 GPU in a smartphone chip. To further boost performance, the chipset integrates MediaTek’s HyperEngine 5.0, the fifth generation of MediaTek’s innovative gaming technology.

HyperEngine 5.0 uses AI-acceleration to optimize graphics while reducing the GPU load, resulting in faster gameplay that looks better and is more power-efficient than ever.

HyperEngine also integrates AI-VRS, the first AI-enhanced variable-rate shading technology for smartphones, along with the industry’s first raytracing software development kit (SDK) using Vulkan for Android.

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Taiwanese chip designer MediaTek Inc said on Friday it had applied to the U.S. government for permission to continue supplying China’s Huawei after new U.S. curbs take effect in mid-September amid rising China-U.S. tensions.

The Trump administration in August expanded its curbs on Huawei and banned suppliers from selling chips made using U.S. technology to the Chinese firm without a special licence.

MediaTek, which analysts said could be among the worst affected following the latest curbs, said it will follow related global trade regulations and has applied for the permission to ship to Huawei after Sept. 15.

“MediaTek reiterates its respect for following relevant orders and rules on global trade, and has already applied for permission with the U.S. side in accordance with the rules,” it said in a brief statement, without elaborating.

Huawei declined to comment.

The U.S. move this month closes potential loopholes in its earlier May sanctions that could have let Huawei buy chips using U.S. technology via third parties.

The curbs underscore the growing rift in Sino-U.S. ties as Washington presses governments to squeeze Huawei out, alleging the company would hand over data to Beijing for spying. Huawei denies it spies for China.

Taiwan Semiconductor Manufacturing Co Ltd (TSMC), the world’s largest contract chipmaker, said last month it had stopped taking new orders from the Chinese telecommunications and smartphone giant in May and does not plan to ship wafers after Sept. 15.

Source: Reuters

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